The G2C Alliance, jointly established by Zhisheng Industry, Junhao Precision and Junhua Precision in 2020, has entered its fifth year this year and has become the only equipment alliance in Taiwan that focuses on advanced packaging. When talking about CoPoS R&D, Junhua Chairman Liang Youwen said that in simple terms, it is an advanced version of CoWoS, but it can increase yield by more than 90%, and is expected to increase profits significantly by 30%. The successful R&D is really a huge profit.
Taiwan's semiconductor equipment industry is ushering in a historic turnaround. The G2C Alliance, jointly established by Zhisheng Industry, Junhao Precision and Junhua Precision in 2020, has entered its fifth year this year and has become the only equipment alliance in Taiwan that focuses on advanced packaging. Its market value has increased by more than five times in less than one billion yuan per year in five years, becoming a new force for the purpose of receiving the AI wave.
Benefiting from the continuous expansion of AI, the driving semiconductor industry has entered a new round of rapid growth. From basic construction to application services, all need to rely on more sophisticated advanced packaging. The members of the G2C happen to be mastering key technologies, including the specialized compression, film sticking, film tearing, baking, and pre-treatment of the elixir. All focus on testing, quantity testing and grinding and polishing. They all have breakthroughs in the Bonder and Sorter platforms. The three parties form technical complementarity and quick response. New process requirements such as CoWoS, SoIC, WMCM, Hybrid Bond, etc.
G2C creates a local and internal supply chainLiang Youwen said that the "Foundry 2.0" trend of downward integration of crystal plants and upward extension of OSAT has gradually taken shape in the past three years, and the role of Taiwan equipment factories has become more critical. The G2C Alliance has deepened its R&D energy through joint exhibitions, technical exchanges and cross-shareholding cooperation. Currently, the number of total staff in the alliance has exceeded 1,700, of which the R&D manpower accounts for more than 30%, showing strong innovative power.
Liang Youwen pointed out that Junhao has recently surpassed 50% of its semiconductor investment, and has successfully converted into a semiconductor stock, further highlighting the transformation results of alliance members, and has cooperated with external partners, such as Shengyang semiconductors. Both parties have started cooperation in new process sites such as grinding and electromechanical equipment, further accelerating the implementation of technology and improving the integrity and stability of supply chains
Liang Youwen shared that with the AI Inspur, the demand for advanced packaging has been comprehensively upgraded, whether it is the size amplification of CoWoS mask, the volume of SoIC technology, or the iteration of HDI for AI, all require higher precision and higher efficiency equipment support. Therefore, the G2C Alliance will continue to focus on the AI industry link, deepen the research and development and local supply chain advantages, and promote the independence of Taiwan's equipment.
CoPoS research and development success will make a fortuneLiang also discussed that in the face of the great demand for AI and HPC, all of them have invested heavily in research and development and strengthened production capacity to ensure that they continue to maintain a leading position in the advanced packaging and processing equipment market, and successfully established a core technology platform that complements Bonder and Sorter, and further extended from CoWoS to new generation applications such as Chip on Panel, Chiplet, SoIC, WMCM and Hybrid Bond.
For CoPoS advanced packaging research and development, Liang Youwen pointed out that simply, CoPoS advanced packaging is an advanced version of CoWoS, but the scope must be improved with the basic accuracy and yield of CoWoS. If the research and development is successful, the yield rate can be improved by more than 90%, which is expected to increase significantly by 30% and make a profit. It is really awesome, but when to ask when the fastest time can be completed, Liang Youwen revealed that he really doesn't know.
Achievement has made its diverse application layout in the next ten yearsZhisan Chairman Liang Maosheng said that Zhisan started out with ovens and PCB equipment and has now become an important link for semiconductor advanced packaging chains. With advanced packaging becoming the key to promoting the extension of Motor's law, the legal person mentioned that Taiwan Electric's production capacity expansion from 2022 to 2026, the average annual growth rates of AI testing, CoWoS and SoIC are as high as 80%, 80% and 100%, respectively, which means that equipment vendors will benefit.
Liang Maosheng pointed out that he is optimistic about the development of AI applications and the role of the leading manufacturer of PCB industry equipment. He is closely following the iteration of HDI for AI technology to provide key process equipment such as Desmear PTH, pressure film, and tearing film. PCB industry accounts for 51% of the first half of the year, of which advanced PCB has grown 7 times in the past five years.
Liang Maosheng shared that the company's business income in the first half of 2025 was 2.819 billion yuan, an annual increase of 16.1%. Among them, the equipment business income in the AI industry chain accounted for more than 65%. The two main growth dynamics are two key industries, namely advanced packaging and advanced PCB. In the future, they will continue to focus on AI applications, including CoWoS, WMCM, SoIC, HBM, Burn-in testing, IC mounting, and advanced HDI.
The proportion of Junhao Precision Semiconductor Construction has accounted for more than 50%Junhao Chairman Chen Zhengxing said that benefiting from the continuous growth of AI, the market size and demand of semiconductor markets such as advanced packaging technology, silicon and recycled crystals have grown significantly. Moreover, the downward integration of crystal plants, the upward development of OSAT factories has become an inevitable trend. Taiwan's semiconductor supply chain will play a more decisive role..
Chen Zhengxing pointed out that with the continuous expansion of the wafer and recycled wafer factories and the increase in capital expenditure, the alliance members have achieved excellent results in the semiconductor field. Junhao Precision semiconductor production has accounted for more than 50%, and has continued to increase stably and steadily. In the future, we will continue to master the implementation of this wave of AI Inspur technology and business machines, and deepen the needs of advanced packaging, recycled wafer industries and OSAT factories.
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