Broadcom announced major advances in its Co-Packaged Optics (CPO) technology and launched the third generation 200G/lane CPO product line. In addition to achieving a technological breakthrough in 200G/lane, Broadcom also demonstrates the mature and developing second-generation 100G/lane CPO products and industry eco-system, and emphasizes important improvements in the process of semiconductor professional OEM, thermal dissipation design, operation processing procedures, fiber routing and overall yield.
Broadcom said that since the launch of the first generation of Tomahawk 4-Humboldt chip set in 2021, it has a leading position in the CPO field, and has led the entire CPO supply chain to enter the learning and verification cycle in advance. This chipset has several key innovative technologies, including high-density integrated optical engines, edge-coupler technology, and removable optical connectors.
Based on this successful foundation, the second-generation Tomahawk 5-Bailly (TH5-Bailly) chip assembly has become the first quantitative CPO solution in the industry. As part of TH5-Bailly's mass production, Broadcom focuses on automated testing and expandable manufacturing processes, laying the foundation for large-scale production in the future generations. By promoting the deployment of 100G/lane CPO product lines, Broadcom has accumulated incomparable experience in CPO system design, integrating optical and electronic components without any data to maximize overall efficiency and create an optical inter-resolving solution with the lowest power consumption in the industry.
Today, Broadcom announced the third-generation 200G/lane CPO product line and promised to develop the fourth-generation 400G/lane solution, and will continue to bring leaders to provide optical interconnection technologies with the lowest power consumption and the highest frequency width density.
Broadcom pointed out that its leading position in the CPO field not only comes from its advanced interchanger ASIC and optical engine technology, but also includes the complete ecological development of passive optical components, interconnected technologies and system solution partners. Through the 100G/lane CPO product line, Broadcom has demonstrated its technological expansion capabilities, not only meeting the growing demand for AI recommendations, but also supporting the next wave of artificial intelligence drive applications.
Near Margalit, deputy president and general manager of Broadcom Optical System Affairs Department, said that Broadcom has been committed to improving CPO platform solutions for many years, which can be seen from the maturity of the second-generation 100G/lane products and the overall eco-system. With the launch of the third-generation 200G/lane CPO solution, we once again set up new poles for the next generation of AI interconnection technology, and Broadcom is committed to providing a commitment to the leading industry's performance, power consumption efficiency and scalability, which will help customers meet the needs of rapidly evolving AI infrastructure.
Broadcom emphasizes that its progress in CPO technology has received public support from many partners in the ecological system. Some important partners also announced important milestones this week, including Corning Incorporated, which announced a partnership with Broadcom to develop advanced optical fiber and connector technology, and the TH5-Bailly platform key components have also begun shipping. Delta Electronics cooperates to produce TH5-Bailly 51.2T CPO Ethernet Interchange with a tight 3RU design, and provides two versions: air-cooled and liquid-cooled.
In addition, the key components that provide high-performance system integration of its CPO LGA socket, pluggable laser module (PLS) shell, and connectors have entered production. As for, Micas Networks is an entry-level production of the TH5-Bailly network interchanger system, which saves more than 30% of the system power consumption compared to a traditional pluggable module system. In addition, Twinstar Technologies' high-density CPO optical fiber shipments have reached major milestones, further promoting the expansion of optical interconnection technology in the basic construction of the next-generation data center.
These partner milestones have been proven to continue to advance in building a complete and fully integrated CPO ecosystem and can support next-generation AI network solutions.
Broadcom further pointed out that its 200G/lane CPO technology is a challenge to the next generation of high-radix vertical scale-up and scale-out network design. This technology requires equal copper interconnection reliability and power consumption efficiency. Therefore, it is important for building vertical expansion domains over 512 points. At the same time, it can also rapidly grow due to the parameters of the new generation of basic model, which poses challenges to bandwidth, power consumption and delay.
Broadcom's third-generation CPO solution is designed to solve expansion-connected problems, providing technical support for problems such as link flaps and operational interruptions to achieve the lowest cost per generation of coins in the industry.. The blueprint of the third and fourth generation CPO products also includes continuous close cooperation with ecological partners to optimize the integration of CPO solutions and ensure that the products meet the strict needs of the super-large data center and AI work load. In addition, Broadcom is also continuing to focus on open standards and system-level optimization, which is important for the continuous success and development of our CPO technology.
下一篇：没有了