Texas Instruments, a major global analog semiconductor manufacturer, announced that its second packaging and testing factory TIEM2 in Malacca, Malaysia has begun operation. It is expected to package and test billions of chips every year in the future, strengthening its global supply chain layout. Over time, the potential investment in the new plant, which is currently being produced, will reach approximately US$1.198 billion and, when fully operational, will provide up to 500 local jobs.
Texas Instruments pointed out that TIEM2 is a factory with advanced production equipment that uses automation technology to complete the bumps, probes, assembly and testing of billions of analog and embedded chips every year. These chips are critical to nearly every type of electronic system, from cars to smartphones to data centers.
Texas Instruments stated that TIEM2 covers an area of more than 900,000 square feet and is connected to Texas Instruments' existing Melaka packaging and test factory. The combined facility will have more than 1.4 million square feet of manufacturing space, and will process processed semiconductor wafers through the back-end process of packaging and testing, and finally convert them into finished wafers.
At this stage, Texas Instruments currently has 15 manufacturing bases around the world, including wafer fabs, packaging and test plants, and bump and probe facilities. Texas Instruments has been present in Malaysia for more than half a century since opening its first factory in Selangor, Malaysia, in 1972, and now has packaging and test facilities in Malacca and Kuala Lumpur. Texas Instruments aims to meet about 90% of its own packaging and test needs by 2030, strengthening the company's in-house manufacturing operations by owning and controlling its supply chain.